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| Philips Semiconductors Product specification Rectifier diodes Schottky barrier FEATURES * Low forward volt drop * Fast switching * Reverse surge capability * High thermal cycling performance * Low thermal resistance BYV116, BYV116B series SYMBOL QUICK REFERENCE DATA VR = 20 V/ 25 V IO(AV) = 10 A VF 0.54 V a1 1 k2 a2 3 GENERAL DESCRIPTION Dual schottky rectifier diodes intended for use as output rectifiers in low voltage, high frequency switched mode power supplies. The BYV116 series is supplied in the SOT78 (TO220AB) conventional leaded package. The BYV116B series is supplied in the SOT404 surface mounting package. PINNING PIN 1 2 3 tab DESCRIPTION anode 1 (a) cathode (k) 1 anode 2 (a) cathode (k) SOT78 (TO220AB) tab SOT404 tab 2 1 23 1 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS BYV118BYV116BVRRM VRWM VR IO(AV) IFRM IFSM Peak repetitive reverse voltage Working peak reverse voltage Continuous reverse voltage Average rectified forward current (both diodes conducting) Repetitive peak forward current per diode Non-repetitive peak forward current per diode Peak repetitive reverse surge current per diode Operating junction temperature Storage temperature Tmb 124 C square wave; = 0.5; Tmb 123 C square wave; = 0.5; Tmb 123 C t = 10 ms t = 8.3 ms sinusoidal; Tj = 125 C prior to surge; with reapplied VRRM(max) pulse width and repetition rate limited by Tj max - 65 MIN. 20 20 20 20 20 10 10 50 55 1 150 175 MAX. 25 25 25 25 25 UNIT V V V A A A A A C C IRRM Tj Tstg 1. It is not possible to make connection to pin 2 of the SOT404 package. March 1998 1 Rev 1.000 Philips Semiconductors Product specification Rectifier diodes Schottky barrier THERMAL RESISTANCES SYMBOL PARAMETER Rth j-mb Rth j-a Thermal resistance junction to mounting base Thermal resistance junction to ambient CONDITIONS BYV116, BYV116B series MIN. - TYP. MAX. UNIT 60 50 4 3.5 K/W K/W K/W K/W per diode both diodes SOT78 package, in free air SOT404 package, pcb mounted, minimum footprint, FR4 board ELECTRICAL CHARACTERISTICS All characteristics are per diode at Tj = 25 C unless otherwise specified SYMBOL PARAMETER VF IR Cd Forward voltage Reverse current Junction capacitance CONDITIONS IF = 5 A; Tj = 125C IF = 10 A; Tj = 125C IF = 5 A VR = VRWM VR = VRWM; Tj = 100C VR = 5 V; f = 1 MHz, Tj = 25C to 125C MIN. TYP. MAX. UNIT 0.47 0.66 0.58 0.05 5 160 0.54 0.77 0.64 3 10 V V V mA mA pF March 1998 2 Rev 1.000 Philips Semiconductors Product specification Rectifier diodes Schottky barrier BYV116, BYV116B series 5 4 3 2 Forward dissipation, PF (W) Vo = 0.31 V Rs = 0.046 Ohms BYV116 Tmb(max) / C D = 1.0 130 134 100mA IR / A 150 C BYV116 10mA 125 C 1mA 100 C 75 C 0.5 0.1 0.2 138 142 I tp D= tp T 100uA 50 C 1 T t 146 150 8 10uA Tj = 25 C 0 0 1 2 3 4 5 6 Average forward current, IF(AV) (A) 7 1uA 0 5 10 VR / V 15 20 25 Fig.1. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x D. Fig.4. Typical reverse leakage current per diode; IR = f(VR); parameter Tj 5 4 3 2 1 0 Forward dissipation, PF (W) Vo = 0.31 V Rs = 0.046 Ohms BYV116 Tmb(max) / C 130 1000 Cd / pF BYV116 4 2.8 2.2 1.9 a = 1.57 134 138 100 142 146 150 5 0 1 2 3 4 Average forward current, IF(AV) (A) 10 1 10 VR / V 100 Fig.2. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). Fig.5. Typical junction capacitance per diode; Cd = f(VR); f = 1 MHz; Tj = 25C to 125 C. 10 IF / A Tj = 25 C Tj = 125 C BYV116 10 Transient thermal impedance, Zth j-mb (K/W) 8 1 6 typ max 0.1 4 0.01 2 P D tp D= tp T t 0 0 0.2 0.4 VF / V 0.6 0.8 1 0.001 1us T 10us 100us 1ms 10ms 100ms 1s 10s pulse width, tp (s) PBYR325CTD Fig.3. Typical and maximum forward characteristic IF = f(VF); parameter Tj Fig.6. Transient thermal impedance; per diode; Zth j-mb = f(tp). March 1998 3 Rev 1.000 Philips Semiconductors Product specification Rectifier diodes Schottky barrier MECHANICAL DATA Dimensions in mm Net Mass: 1.4 g 10.3 max BYV116, BYV116B series 4.5 max 1.4 max 11 max 15.4 2.5 0.85 max (x2) 2.54 (x2) 0.5 Fig.7. SOT404 : centre pin connected to mounting base. MOUNTING INSTRUCTIONS Dimensions in mm 11.5 9.0 17.5 2.0 3.8 5.08 Fig.8. SOT404 : minimum pad sizes for surface mounting. Notes 1. Plastic meets UL94 V0 at 1/8". March 1998 4 Rev 1.000 Philips Semiconductors Product specification Rectifier diodes Schottky barrier MECHANICAL DATA Dimensions in mm Net Mass: 2 g BYV116, BYV116B series 4,5 max 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 2,54 2,54 0,9 max (3x) 0,6 2,4 Fig.9. SOT78 (TO220AB); pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for SOT78 (TO220) envelopes. 2. Epoxy meets UL94 V0 at 1/8". March 1998 5 Rev 1.000 Philips Semiconductors Product specification Rectifier diodes Schottky barrier DEFINITIONS Data sheet status Objective specification Product specification Limiting values BYV116, BYV116B series This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. March 1998 6 Rev 1.000 |
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